The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 18, 2022

Filed:

Jun. 10, 2020
Applicants:

Autonetworks Technologies, Ltd., Yokkaichi, JP;

Sumitomo Wiring Systems, Ltd., Yokkaichi, JP;

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventors:

Yoshimasa Shirai, Yokkaichi, JP;

Yasushi Saito, Yokkaichi, JP;

Kingo Furukawa, Yokkaichi, JP;

Mitsuhiro Kumondai, Yokkaichi, JP;

Akihisa Hosoe, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/03 (2006.01); H01R 43/16 (2006.01); H01R 4/18 (2006.01); H01R 13/11 (2006.01);
U.S. Cl.
CPC ...
H01R 13/03 (2013.01); H01R 43/16 (2013.01); H01R 4/185 (2013.01); H01R 13/11 (2013.01);
Abstract

Provided is an electrical contact material that can suppress an increase in contact resistance even if contact pressure with a counterpart material is small. An electrical contact material that includes a base material made of metal, a metal layer provided on a surface of the base material, and an oxide layer provided on a surface of the metal layer. The metal layer is made of metal that contains zinc, copper, and tin, the oxide layer is made of an oxide that contains zinc, copper, and tin, and beneath the oxide layer, a ratio of the atomic concentration of copper to the atomic concentration of tin is less than 1.4.


Find Patent Forward Citations

Loading…