The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 18, 2022

Filed:

Jul. 15, 2020
Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Tadashi Sugahara, Kyoto, JP;

Takaaki Ishii, Kyoto, JP;

Kengo Onaka, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 1/203 (2006.01); H01P 3/08 (2006.01); H01Q 1/22 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H01Q 1/24 (2006.01); H01Q 1/38 (2006.01); H01Q 9/27 (2006.01); H03H 7/38 (2006.01); H01P 1/213 (2006.01);
U.S. Cl.
CPC ...
H01P 1/20345 (2013.01); H01P 1/203 (2013.01); H01P 1/2135 (2013.01); H01P 3/08 (2013.01); H01P 3/088 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/243 (2013.01); H01Q 1/38 (2013.01); H01Q 9/27 (2013.01); H03H 7/38 (2013.01); H05K 1/0243 (2013.01); H05K 1/115 (2013.01); H05K 2201/10098 (2013.01);
Abstract

The present disclosure relates to an interposer (), which is a circuit board that has a multilayer structure and that establishes a connection between layers using a via conductor. The interposer () includes first and second transmission lines that are connected in series and a first stub and a second stub that are respectively connected to the first transmission line and the second transmission line. The first and second stubs are formed by wiring lines provided in respective different layers, and a second transmission line (), which connects the first stub to the second stub, includes a via conductor and a wiring line provided in the layer where the second stub () is formed.


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