The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 18, 2022

Filed:

Mar. 01, 2019
Applicants:

Hefei Xinsheng Optoelectronics Technology Co., Ltd., Anhui, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Yubao Kong, Beijing, CN;

Xuewu Xie, Beijing, CN;

Yu Ai, Beijing, CN;

Ameng Zhang, Beijing, CN;

Bowen Liu, Beijing, CN;

Shi Sun, Beijing, CN;

Hao Liu, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 51/00 (2006.01); H01L 51/52 (2006.01); H01L 51/56 (2006.01); H01L 27/32 (2006.01); H01L 51/50 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0016 (2013.01); H01L 51/5228 (2013.01); H01L 51/56 (2013.01); H01L 27/3276 (2013.01); H01L 51/5012 (2013.01); H01L 2227/323 (2013.01); H01L 2251/5315 (2013.01);
Abstract

The present disclosure is related to a method of manufacturing an array substrate. The method of manufacturing an array substrate may include forming an auxiliary cathode on a base substrate, forming a layer of magnetic material on a first surface of the auxiliary cathode, forming an emission layer in a display area of the array substrate, a part of the emission layer on the layer of the magnetic material on the first surface of the auxiliary cathode, and removing the part of the emission layer and the layer of magnetic material from the first surface of the auxiliary cathode.


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