The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 18, 2022

Filed:

Oct. 08, 2019
Applicant:

Facebook Technologies, Llc, Menlo Park, CA (US);

Inventors:

Céline Claire Oyer, Cork, IE;

Allan Pourchet, Cork, IE;

Assignee:

Facebook Technologies, LLC, Menlo Park, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/62 (2010.01); H01L 33/06 (2010.01); H01L 21/66 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 33/0095 (2013.01); H01L 21/6838 (2013.01); H01L 22/14 (2013.01); H01L 33/06 (2013.01); H01L 33/62 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A method for manufacturing LED devices is provided. The method comprises forming an epitaxial layer on a starter substrate, the epitaxial layer having a first surface that interfaces with the starter substrate and a second surface opposite to the first surface; establishing an adhesive bond between the second surface of the epitaxial layer and a carrier substrate having a pre-determined light transmittance; etching away the starter substrate; etching away part of the epitaxial layer to form a plurality of light emitting diode (LED) dies on a third surface of the epitaxial layer opposite to the second surface; establishing one or more conductive bonds between selected one or more LED dies, from the plurality of LED dies, and a backplane; weakening the adhesive bond between the second surface of the epitaxial layer and the carrier substrate; and moving the carrier substrate away from the backplane.


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