The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 18, 2022

Filed:

Mar. 05, 2020
Applicant:

Kioxia Corporation, Minato-ku, JP;

Inventors:

Tomoya Sanuki, Yokkaichi, JP;

Masayoshi Tagami, Kuwana, JP;

Assignee:

Kioxia Corporation, Minato-ku, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 25/18 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 24/08 (2013.01); H01L 24/80 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2225/06524 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1434 (2013.01);
Abstract

In one embodiment, a semiconductor device includes a substrate, a plurality of transistors provided on the substrate. The device further includes a first interconnect layer provided above the transistors and electrically connected to at least one of the transistors, one or more first plugs provided on the first interconnect layer, and a first pad provided on the first plugs. The device further includes a second pad provided on the first pad, one or more second plugs provided on the second pad, and a second interconnect layer provided on the second plugs. The device further includes a memory cell array provided above the second interconnect layer and electrically connected to the second interconnect layer. A number of the second plugs on the second pad is larger than a number of the first plugs under the first pad.


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