The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 18, 2022
Filed:
May. 12, 2020
Applicant:
Realtek Semiconductor Corp., HsinChu, TW;
Inventors:
Assignee:
Realtek Semiconductor Corp., HsinChu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0652 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 24/48 (2013.01); H01L 2224/48227 (2013.01); H01L 2225/0651 (2013.01);
Abstract
A semiconductor package includes a carrier substrate including opposite first surface and second surface; a first chip and a second chip mounted on the first surface of the carrier substrate in a side-by-side manner, wherein the first chip has a plurality of high-speed signal pads disposed along its first side adjacent to the second chip, and the second chip has a plurality of data (DQ) pads along its second side adjacent to the first chip; and a plurality of first bonding wires, directly connecting the plurality of high-speed signal pads to the plurality of data (DQ) pads.