The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 18, 2022

Filed:

Dec. 18, 2019
Applicant:

Realtek Semiconductor Corp., Hsinchu, TW;

Inventors:

Chao-Min Lai, Hsinchu, TW;

Ping-Chia Wang, Hsinchu, TW;

Han-Chieh Hsieh, Hsinchu, TW;

Tang-Hung Chang, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/14 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 2224/14177 (2013.01);
Abstract

A control device and a circuit board are provided. The control device can cooperate with the circuit board, and includes a ball grid array. The ball grid array includes a plurality of power balls and a plurality of ground balls, which are jointly arranged in a ball region. The power balls and the ground balls are respectively divided into a plurality of power ball groups and a plurality of ground ball groups. One of the ground ball groups includes two ground balls and is adjacent to a power ball group. A ball pitch between the two ground balls is greater than that between one of the power balls and one of the ground balls adjacent to each other. The circuit board includes a contact pad array corresponding to the ball grid array of the control device so that the control device can be disposed on the circuit board.


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