The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 18, 2022

Filed:

Oct. 28, 2019
Applicant:

Sumitomo Wiring Systems, Ltd., Mie, JP;

Inventors:

Junya Aichi, Mie, JP;

Jun Ikeda, Mie, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/32 (2006.01); H01L 23/50 (2006.01); H01L 25/07 (2006.01); H01L 23/367 (2006.01); H01L 23/36 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3672 (2013.01); H01L 23/50 (2013.01); H01L 25/072 (2013.01); H01L 23/36 (2013.01);
Abstract

A heat radiating member and an electrical junction box are provided that have a simple configuration and are capable of quickly radiating heat generated by a semiconductor device. A support member, which receives heat from a substrate portion having a mounting face on which a semiconductor device is mounted, via an opposing plate portion opposing the mounting face, and radiates the received heat, includes a recessed portion formed in the opposing plate portion, at a position corresponding to the semiconductor device. The recessed portion has a wall thickness that is greater than that of another portion of the opposing plate portion.


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