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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11227808 B1

PDFFull Text
Date of Patent:
Jan. 18, 2022

Filed:

Mar. 06, 2018

Power module and method for fabricating the same, and power conversion device

Applicant:

Mitsubishi Electric Corporation, Chiyoda-ku, JP;

Inventor:

Haruko Hitomi, Chiyoda-ku, JP;

Assignee:

MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;

Attorney:

Xsensus LLP

Primary Examiner:

Jasmine J Clark

Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/367 (2006.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H02M 7/00 (2006.01); H05K 1/02 (2006.01); H05K 5/02 (2006.01); H05K 5/06 (2006.01); H05K 7/14 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3121 (2013.01); H01L 21/4817 (2013.01); H01L 21/4853 (2013.01); H01L 21/565 (2013.01); H01L 23/3675 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01); H02M 7/003 (2013.01); H05K 1/0271 (2013.01); H05K 5/0217 (2013.01); H05K 5/064 (2013.01); H05K 7/1427 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48177 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/35121 (2013.01);
Abstract

A power module which inhibits disjoin between a sealing resin and an adhesive. The power module includes: an insulative substrate having a semiconductor element mounted on the top surface; a base plate joined to the rear surface of the insulative substrate; a case member with the base plate, that surrounds the insulative substrate, the case member having a bottom surface whose inner periphery portion side being in contact with a top surface of the base plate, the bottom surface being provided with an angled surface whose distance to the top surface of the base plate increases toward an outer periphery side of the base plate; an adhesive member filled between the base plate and the angled surface to adhere the base plate and the case member; and a filling member filled in a region bounded by the base plate and the case member.

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