The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 18, 2022
Filed:
Sep. 26, 2019
International Business Machines Corporation, Armonk, NY (US);
Layne A. Berge, Rochester, MN (US);
Matthew Doyle, Chatfield, MN (US);
Kyle Schoneck, Rochester, MN (US);
Thomas W. Liang, Rochester, MN (US);
Matthew A. Walther, Rochester, MN (US);
Jason J. Bjorgaard, Rochester, MN (US);
John R. Dangler, Rochester, MN (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Electrical current flow in a ball grid array (BGA) package can be measured by an apparatus including an integrated circuit (IC) electrically connected to the BGA package. Solder balls connect the BGA package to a printed circuit board (PCB). A current sense loop can be fabricated on a wiring plane of the PCB to encircle a current supply via that supplies current to an IC mounted on the BGA package. A MUX/Sequencer can sequentially connect wires of the current sense loop to an amplifier. The amplifier can amplify a voltage induced on the current sense mesh by current flow into the BGA package. A sensing analog-to-digital converter (ADC) is electrically connected to convert a voltage at the output of the amplifier into digital output signals.