The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 18, 2022

Filed:

Oct. 10, 2018
Applicant:

Integrated Device Technology, Inc., San Jose, CA (US);

Inventors:

Raik Richter, Kreischa, DE;

Marko Mailand, Dresden, DE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01J 5/30 (2006.01); G01J 5/06 (2006.01); G01K 7/01 (2006.01); G01J 5/08 (2006.01);
U.S. Cl.
CPC ...
G01J 5/30 (2013.01); G01J 5/06 (2013.01); G01J 5/089 (2013.01); G01J 5/0831 (2013.01); G01J 5/0862 (2013.01); G01K 7/01 (2013.01); G01J 5/061 (2013.01); G01J 2005/065 (2013.01); G01J 2005/068 (2013.01);
Abstract

A temperature sensor module with an integrated lid structure for spurious IR-cancellation is disclosed. An improved temperature sensor module that allows detection of a maximum of the relevant IR-radiation from an object's surface of interest as well as generation of additional information about parasitic or spurious IR-radiation that distort the relevant thermal signal in order to enable a cancellation of interfering thermal signal portions is presented. The temperature sensor module includes a temperature sensing element, a sensor-interface control integrated circuit, whereas the temperature sensing element is coupled to the sensor-interface control IC, and a lid structure and a sensor packaging both defining a field of view of the temperature sensor module, wherein the lid structure is formed by a substrate comprising a second integrated temperature sensor connected to the sensor-interface control IC or an external connected processing unit.


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