The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 18, 2022

Filed:

Feb. 02, 2018
Applicant:

Sensus Spectrum Llc, Morrisville, NC (US);

Inventor:

Justin Rorke Buckland, Cambridge, GB;

Assignee:

Sensus Spectrum, LLC, Morrisville, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 1/06 (2006.01); F04B 43/04 (2006.01); B06B 1/06 (2006.01); H04R 17/00 (2006.01); H01L 41/29 (2013.01); G10K 11/00 (2006.01); H01L 41/313 (2013.01); F04B 45/047 (2006.01); H01L 41/047 (2006.01); H01L 41/09 (2006.01);
U.S. Cl.
CPC ...
F04B 43/046 (2013.01); B06B 1/06 (2013.01); B06B 1/0603 (2013.01); B06B 1/0688 (2013.01); F04B 45/047 (2013.01); G10K 11/004 (2013.01); H01L 41/047 (2013.01); H01L 41/0475 (2013.01); H01L 41/0477 (2013.01); H01L 41/0973 (2013.01); H01L 41/29 (2013.01); H01L 41/313 (2013.01); H04R 1/06 (2013.01); H04R 17/00 (2013.01);
Abstract

Bending mode transducers are provided including a substrate made of a high density material, the substrate having a first surface and a second surface, opposite the first surface. A piezoelectric layer is provided on the first surface of the substrate and at least one patterned electrode is provided on the piezoelectric layer. A mounting block is on the at least one patterned electrode at least one electrical contact point is provided on the first surface of the substrate remote from the at least one patterned electrode. Related devices and methods are also provided.


Find Patent Forward Citations

Buckland, Justin. (2022). Multi-element bending transducers and related methods and devices (U.S. Patent No. 11225961). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11225961

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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