The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 18, 2022
Filed:
Jul. 11, 2017
Applicant:
Dexerials Corporation, Tokyo, JP;
Inventors:
Junichi Sugawara, Tome, JP;
Yuichi Kamori, Tome, JP;
Assignee:
Dexerials Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/34 (2006.01); C04B 35/00 (2006.01); H01J 37/34 (2006.01); C23C 14/08 (2006.01); C23C 14/00 (2006.01); C04B 35/453 (2006.01);
U.S. Cl.
CPC ...
C23C 14/3421 (2013.01); C04B 35/00 (2013.01); C04B 35/453 (2013.01); C23C 14/0036 (2013.01); C23C 14/08 (2013.01); C23C 14/081 (2013.01); C23C 14/086 (2013.01); C23C 14/3414 (2013.01); H01J 37/3429 (2013.01); H01J 37/3491 (2013.01);
Abstract
Provided are a Mn—Zn—O sputtering target that can be used for DC sputtering and a production method therefor. The Mn—Zn—O sputtering target has a chemical composition containing Mn, Zn, O, and an element X (X is one or two elements selected from the group consisting of W and Mo). A surface to be sputtered of the target has an arithmetic mean roughness Ra of 1.5 μm or less or a maximum height Ry of 10 μm or less.