The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 18, 2022
Filed:
Sep. 15, 2017
Applicant:
Jsp Corporation, Tokyo, JP;
Inventors:
Shota Takagi, Yokkaichi, JP;
Masaharu Oikawa, Tokyo, JP;
Assignee:
JSP Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 9/18 (2006.01); B29C 44/34 (2006.01); B29C 44/44 (2006.01); B29K 23/00 (2006.01); C08K 5/00 (2006.01);
U.S. Cl.
CPC ...
C08J 9/18 (2013.01); B29C 44/3461 (2013.01); B29C 44/445 (2013.01); B29K 2023/08 (2013.01); C08J 2205/044 (2013.01); C08J 2323/08 (2013.01); C08J 2323/18 (2013.01); C08K 5/0016 (2013.01); C08K 5/0025 (2013.01); C08K 5/0083 (2013.01);
Abstract
The present invention provides expanded beads comprising a crosslinked multi-block copolymer containing an ethylene block and an ethylene-α-olefin copolymer block, having an apparent density of 40 to 300 g/L, a gel fraction of 30 to 70% by weight by a hot xylene extraction method, an average cell diameter (a) of 50 to 180 μm, and an average surface layer thickness (b) of 3 to 27 μm, and the expanded beads are excellent in in-mold moldability, and can produce an expanded beads molded article being excellent in tensile characteristics in a well balanced manner.