The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 18, 2022
Filed:
Dec. 16, 2016
Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;
Hatsuki Oguro, Hiratsuka, JP;
Tomonori Kato, Hiratsuka, JP;
Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;
Abstract
Provide is a polyamide resin that can yield a molded article with good appearance and good solder reflowability, while keeping low water absorption rate; a molded article; and a method for manufacturing a polyamide resin. The polyamide resin, which is composed of a structural unit derived from diamine and a structural unit derived from dicarboxylic acid; 70 mol % or more of the structural unit derived from diamine being derived from 1,4-bis(aminomethyl)cyclohexane, 1,4-bis(aminomethyl)cyclohexane having a molar ratio (cis:trans) of 35:65 to 0:100, 70 mol % or more of the structural unit derived from dicarboxylic acid being derived from a straight chain aliphatic α,ω-dicarboxylic acid having 8 to 12 carbon atoms, the polyamide resin containing 20 to 100 ppm by mass of phosphorus atom, and containing calcium atom so that the molar ratio given by (phosphorus atom):(calcium atom) will be 1:0.3 to 0.7.