The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 18, 2022

Filed:

Aug. 22, 2017
Applicant:

Nisshinbo Holdings Inc., Tokyo, JP;

Inventors:

Mitsuhiko Yoshimoto, Chiba, JP;

Takahiro Shimoyama, Chiba, JP;

Mami Iizuka, Chiba, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 18/80 (2006.01); C08G 18/10 (2006.01); C08G 18/32 (2006.01); C08G 18/42 (2006.01); C08G 18/48 (2006.01); C08G 18/62 (2006.01); C08G 18/66 (2006.01); C08G 18/73 (2006.01); C08J 5/18 (2006.01); C08K 3/22 (2006.01); C08K 9/04 (2006.01); F28F 21/06 (2006.01); F28F 13/00 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
C08G 18/8029 (2013.01); C08G 18/10 (2013.01); C08G 18/3218 (2013.01); C08G 18/4238 (2013.01); C08G 18/4854 (2013.01); C08G 18/6208 (2013.01); C08G 18/6603 (2013.01); C08G 18/73 (2013.01); C08J 5/18 (2013.01); C08K 3/22 (2013.01); C08K 9/04 (2013.01); F28F 21/06 (2013.01); C08J 2375/04 (2013.01); C08K 2003/222 (2013.01); C08K 2201/001 (2013.01); F28F 2013/001 (2013.01); F28F 2255/02 (2013.01); H05K 7/2039 (2013.01);
Abstract

There is provided a heat-conductive flexible sheet that is formed of a non-silicone material and excellent in flexibility as well as durability such as heat-aging resistance, hydrothermal resistance, and thermal shock resistance, and a heat dissipation structure using the same, as well as a resin composition that exhibits excellent handleability in the kneading step in producing a heat-conductive sheet and can be suitably used as a binder material for a heat-conductive flexible sheet. A resin composition comprising a blocked urethane prepolymer, a predetermined epoxy compound, and a curing catalyst, the blocked urethane prepolymer being a reaction product of an aliphatic diisocyanate compound and a hydrogenated polybutadiene polyol having a hydroxy group at each of both ends, wherein the reaction product has at an end thereof an isocyanate group blocked with an aromatic hydroxy compound; a heat-conductive flexible sheet formed of a cured product of a mixed composition comprising the same and a heat-conductive inorganic filler; and a heat dissipation structure using the same.


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