The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 18, 2022

Filed:

Jan. 23, 2018
Applicant:

Hewlett-packard Development Company, L.p., Spring, TX (US);

Inventors:

Stan E. Leigh, Corvallis, OR (US);

Kellie Susanne Jensen, Corvallis, OR (US);

Terry McMahon, Corvallis, OR (US);

Donald W. Schulte, Corvallis, OR (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/175 (2006.01); B41J 2/14 (2006.01); B41J 2/015 (2006.01); B41J 2/135 (2006.01);
U.S. Cl.
CPC ...
B41J 2/14 (2013.01); B41J 2/015 (2013.01); B41J 2/135 (2013.01); B41J 2/17523 (2013.01); B41J 2/17526 (2013.01);
Abstract

In one example in accordance with the present disclosure, a fluidic die is described. The fluidic die includes a surface on which a number of nozzles are formed. An electrical interface on the fluidic die establishes an electrical connection between the fluidic die and a fluidic die controller. The electrical interface includes 1) a bond pad disposed within a bond pad region of the surface and 2) an electrical lead coupled to the bend pad to establish an electrical connection between the fluidic die and the fluidic die controller. The fluidic die also includes a beveled edge along an edge of the surface underneath the electrical lead.


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