The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 18, 2022

Filed:

Dec. 21, 2015
Applicant:

Schott Glass Technologies (Suzhou) Co. Ltd., Jiang Su, CN;

Inventors:

Pengxiang Qian, Shanghai, CN;

Chong Wang, Suzhou, CN;

Feng He, Suzhou, CN;

Yunfei Hou, Wuhan, CN;

Rainer Liebald, Nauheim, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 17/06 (2006.01); B32B 43/00 (2006.01); B32B 37/00 (2006.01); B32B 7/04 (2019.01); B32B 9/00 (2006.01); B32B 37/10 (2006.01); B32B 38/10 (2006.01);
U.S. Cl.
CPC ...
B32B 17/06 (2013.01); B32B 7/04 (2013.01); B32B 9/005 (2013.01); B32B 37/003 (2013.01); B32B 37/10 (2013.01); B32B 38/10 (2013.01); B32B 43/006 (2013.01); B32B 2037/1063 (2013.01); B32B 2255/20 (2013.01); B32B 2310/025 (2013.01); B32B 2315/08 (2013.01); B32B 2457/08 (2013.01); B32B 2457/10 (2013.01); B32B 2457/16 (2013.01); B32B 2457/206 (2013.01);
Abstract

A method for making a bonded article, wherein a thin glass substrate is bonded on a support substrate in the absence of any interlayer by an electrostatic adhesion process with the assistance of external pressure, the pressure is applied constantly or stepwise during the adhesion process by use of a tool such as a roll or a wheel or other movable device with curved surface. The bonded article has no defects, e.g. bubbles or inclusions, in the bonded interface, which benefits transportation of the thin glass substrate and its post-processing as well. Such defect-free bonded article is also disclosed. Pressure supported electrostatic adhesion, initiated by electrostatic charges adhesion of a two members, e.g. a substrate member and a support member, is enabled to minimize, prevent and exclude defects, distortion between the adhered surfaces.


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