The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 18, 2022

Filed:

Mar. 01, 2019
Applicant:

The Boeing Company, Chicago, IL (US);

Inventors:

Adriana Willempje Blom-Schieber, Shoreline, WA (US);

Jack Schieber, Shoreline, WA (US);

Assignee:

THE BOEING COMPANY, Chicago, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 33/20 (2006.01); B22C 9/06 (2006.01); B22C 11/00 (2006.01); B29C 33/30 (2006.01);
U.S. Cl.
CPC ...
B29C 33/202 (2013.01); B22C 9/062 (2013.01); B22C 11/00 (2013.01); B29C 33/302 (2013.01);
Abstract

An assembly includes a first mold component defining a first portion of a mold cavity and a first slot. The first slot corresponds to a first portion of a retention channel. The assembly also includes a second mold component defining a second portion of the mold cavity and a second slot. The second slot corresponds to a second portion of the retention channel. The assembly also includes a connector having a cross-sectional shape corresponding to a cross-sectional shape of the retention channel. The connector has thermal expansion characteristics that are different from thermal expansion characteristics of the first and second mold components such that when the first and second mold components are in contact and the connector is inserted into the retention channel, heating the assembly causes differential thermal expansion of the connector and the mold components resulting in a clamping force between the mold components.


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