The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 18, 2022

Filed:

May. 03, 2018
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Dheepa Srinivasan, Bangalore, IN;

Joydeep Pal, Bangalore, IN;

M. Raghunandan, Bangalore, IN;

Rohit Sen, Bangalore, IN;

Sridhar Balaram, Bangalore, IN;

Mohamed Aleem, Bangalore, IN;

Assignee:

General Electric Company, Schenectady, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 7/06 (2006.01); B22F 5/04 (2006.01); B22F 7/02 (2006.01); B33Y 80/00 (2015.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); B33Y 40/00 (2020.01); C22C 1/04 (2006.01); F01D 5/28 (2006.01); F01D 5/00 (2006.01); B23P 6/00 (2006.01); B22F 7/08 (2006.01); B22F 10/20 (2021.01); C22C 19/07 (2006.01); B33Y 30/00 (2015.01); B22F 10/30 (2021.01);
U.S. Cl.
CPC ...
B22F 7/062 (2013.01); B22F 5/04 (2013.01); B22F 7/02 (2013.01); B22F 7/08 (2013.01); B22F 10/20 (2021.01); B23P 6/005 (2013.01); B33Y 10/00 (2014.12); B33Y 40/00 (2014.12); B33Y 70/00 (2014.12); B33Y 80/00 (2014.12); C22C 1/0433 (2013.01); C22C 19/07 (2013.01); F01D 5/005 (2013.01); F01D 5/28 (2013.01); B22F 10/30 (2021.01); B22F 2007/068 (2013.01); B22F 2301/15 (2013.01); B22F 2301/35 (2013.01); B22F 2998/10 (2013.01); B33Y 30/00 (2014.12); F05D 2230/22 (2013.01); F05D 2230/232 (2013.01); F05D 2230/31 (2013.01); F05D 2240/122 (2013.01); F05D 2240/304 (2013.01); F05D 2300/131 (2013.01); F05D 2300/132 (2013.01); F05D 2300/175 (2013.01);
Abstract

A method for forming a secondary component from an original component having an original shape includes separating the original component into a parent component and a replaced portion, and forming a replacement coupon using an additive manufacturing system. The replacement coupon is shaped to substantially match the original shape of the replaced portion. The method further includes coupling the replacement coupon to the parent component to form the secondary component. The method also includes at least one of (i) removing the replacement coupon from a build plate of the additive manufacturing system prior to application of any heat treatment to the as-built replacement coupon, wherein the replacement coupon maintains a near-net original shape of the replaced portion after removal, and (ii) entering the secondary component into normal duty with no hot isostatic press treatment of the replacement coupon having been performed.


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