The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 18, 2022

Filed:

Mar. 01, 2018
Applicant:

Cook Medical Technologies Llc, Bloomington, IN (US);

Inventors:

Ronan T. Young, Spencer, IN (US);

Erik A. Rasmussen, Slagelse, DK;

Jens Schultz, Skovlunde, DK;

Assignee:

COOK MEDICAL TECHNOLOGIES LLC, Bloomington, IN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21F 45/00 (2006.01); A61F 2/88 (2006.01); B21F 1/00 (2006.01); A61F 2/07 (2013.01); A61F 2/92 (2013.01); A61F 2/844 (2013.01); A61F 2/91 (2013.01);
U.S. Cl.
CPC ...
B21F 45/008 (2013.01); A61F 2/07 (2013.01); A61F 2/88 (2013.01); A61F 2/92 (2013.01); B21F 1/00 (2013.01); B21F 45/00 (2013.01); A61F 2/844 (2013.01); A61F 2/91 (2013.01); A61F 2210/0014 (2013.01); A61F 2240/001 (2013.01);
Abstract

A method of making a self-expanding stent entails applying a bend stress sufficient to over-bend a portion of a wire by an amount in a range from about 85% to about 105%, where the wire comprises a Ni—Ti alloy and includes from about 40% to about 46% cold work. The bend stress is then released, thereby forming a bend having a predetermined bend angle in the wire. The application and release of the bend stress are repeated on successive portions of the wire in order to create a series of bends along a length of the wire in a predetermined bend pattern. The wire comprising the predetermined bend pattern is then positioned about a mandrel in an expanded stent geometry and heat set. Thus, a self-expanding stent is formed.


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