The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 18, 2022
Filed:
Nov. 10, 2016
Applicant:
Cornell University, Ithaca, NY (US);
Inventors:
Yong Lak Joo, Ithaca, NY (US);
Yevgen Zhmayev, Ithaca, NY (US);
Assignee:
CORNELL UNIVERSITY, Ithaca, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
B05B 5/03 (2006.01); C08L 101/00 (2006.01); B05D 1/04 (2006.01); C09D 7/61 (2018.01); C09D 7/20 (2018.01); C09D 7/40 (2018.01); B05D 1/06 (2006.01); C09D 129/04 (2006.01); B05D 5/08 (2006.01); B05D 3/04 (2006.01);
U.S. Cl.
CPC ...
B05B 5/03 (2013.01); B05D 1/04 (2013.01); B05D 1/06 (2013.01); B05D 5/08 (2013.01); C08L 101/00 (2013.01); C09D 7/20 (2018.01); C09D 7/61 (2018.01); C09D 7/67 (2018.01); C09D 129/04 (2013.01); B05D 3/042 (2013.01); B05D 2601/20 (2013.01);
Abstract
Provided in certain embodiments herein are alternating current electrospray systems and processes for manufacturing depositions, such as thin layer depositions. In some embodiments, processes and systems provided herein are suitable for and configured to manufacture uniform depositions, such as having uniform thickness.