The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 18, 2022

Filed:

Feb. 02, 2017
Applicant:

Boehringer Ingelheim Microparts Gmbh, Dortmund, DE;

Inventors:

Klaus Kadel, Witten, DE;

Lothar Keydel, Dortmund, DE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61M 11/00 (2006.01); B05B 1/14 (2006.01); B29C 45/37 (2006.01); B81C 99/00 (2010.01); B29C 33/42 (2006.01); A61M 15/02 (2006.01); A61M 15/00 (2006.01); B29C 45/26 (2006.01); B29L 31/00 (2006.01); B29C 45/00 (2006.01); B29C 33/32 (2006.01); B29C 33/30 (2006.01); B29K 705/08 (2006.01);
U.S. Cl.
CPC ...
A61M 11/003 (2014.02); A61M 11/007 (2014.02); A61M 15/009 (2013.01); A61M 15/025 (2014.02); B05B 1/14 (2013.01); B29C 33/424 (2013.01); B29C 45/2673 (2013.01); B29C 45/372 (2013.01); B81C 99/009 (2013.01); B81C 99/0085 (2013.01); A61M 2205/0244 (2013.01); A61M 2205/0272 (2013.01); A61M 2207/10 (2013.01); B29C 33/306 (2013.01); B29C 33/32 (2013.01); B29C 45/2675 (2013.01); B29C 2033/426 (2013.01); B29C 2045/0094 (2013.01); B29C 2045/2638 (2013.01); B29K 2705/08 (2013.01); B29L 2031/753 (2013.01); B29L 2031/756 (2013.01); B81B 2201/058 (2013.01);
Abstract

The invention relates to a nozzle for use in a device for administering a liquid medical formulation, to a method for producing the nozzle in the form of a microfluidic component and to a tool for producing microstructures of the microfluidic component. The nozzle is formed by a plastics plate with groove-like microstructures which are covered by a plastics cover on the longitudinal side in a fixed manner. The production method includes a moulding process in which a moulding tool is used, which moulding tool has complementary metal microstructures which have been produced from a semiconductor material in an electrodeposition process by means of a master component.


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