The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 11, 2022

Filed:

Apr. 09, 2021
Applicant:

Vitesco Technologies Germany Gmbh, Hannover, DE;

Inventors:

Thomas Rumrich, Nuremberg, DE;

Markus Heckel, Schwabach, DE;

Jürgen Sauerbier, Hannover, DE;

Johannes Bock, Hannover, DE;

Juergen Hornberger, Nuremberg, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 5/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); H05K 1/0206 (2013.01); H05K 1/0259 (2013.01); H05K 1/0268 (2013.01); H05K 1/116 (2013.01); H05K 1/18 (2013.01); H05K 5/0082 (2013.01); H05K 2201/09518 (2013.01); H05K 2201/09536 (2013.01);
Abstract

The disclosure provides a circuit board that includes: a carrier element having a number of circuit board layers; a number of electronic components; a number of thermal interfaces; and a number of electrical interfaces. The electronic components are arranged directly on at least one of the surface sides on the carrier element. The opposite surface side of the carrier element is of potential-free design. Additionally, the circuit board with the electronic components is overlaid by a covering material in such a way that the electronic components are mechanically stabilized and the thermal and/or electrical interfaces are free of the covering material.


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