The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2022
Filed:
Dec. 17, 2019
Applicant:
Saft America, Cockeysville, MD (US);
Inventors:
James Snyder, Cockeysville, MD (US);
Jared Good, Cockeysville, MD (US);
Assignee:
SAFT AMERICA, Cockeysville, MD (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01M 50/50 (2021.01); H01M 50/519 (2021.01); H01M 50/502 (2021.01); H01M 50/505 (2021.01); H01M 10/42 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0204 (2013.01); H01M 10/425 (2013.01); H01M 50/502 (2021.01); H01M 50/505 (2021.01); H01M 50/519 (2021.01); H05K 1/144 (2013.01); H01M 2220/30 (2013.01); H05K 2201/09072 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/10037 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10272 (2013.01);
Abstract
A power electronics assembly may include a power component having a thermally and electrically conductive surface; a printed circuit board having a slot; and a bussing element having a protrusion that directly contacts the thermally and electrically conductive surface of the power component via the slot of the printed circuit board, the printed circuit board being disposed between the power component and the bussing element.