The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 11, 2022

Filed:

Mar. 18, 2020
Applicant:

Logitech Europe S.a., Lausanne, CH;

Inventors:

Fabrice Sauterel, Lausanne, CH;

Christopher Pate, San Lorenzo, CA (US);

Laurent Plancherel, Lausanne, CH;

Assignee:

Logitech Europe S.A., Lausanne, CH;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02J 50/10 (2016.01); G06F 3/0354 (2013.01); H02J 50/00 (2016.01); H02J 50/90 (2016.01); G06F 3/039 (2013.01);
U.S. Cl.
CPC ...
H02J 50/005 (2020.01); H02J 50/10 (2016.02); H02J 50/90 (2016.02); G06F 3/0395 (2013.01); G06F 3/03543 (2013.01);
Abstract

An apparatus including a removable modular insert disposed within a housing of a host device, the housing including one or more magnets, and one or more conductive contacts disposed on the removable modular insert to magnetically couple to the one or more magnets and secure the modular insert within the housing of the host device, and electrically couple the modular insert to the host device. A conductive coil can be coupled to the modular insert to electromagnetically receive power from a base device having a surface, where the host device moves and operates along the surface of the base device. The apparatus can include a communication device and a processor to control the communication device for communication between the modular insert and the host device, and control operation of the conductive coil. The communication device further controls the electromagnetic coupling between the modular insert and the base device.


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