The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 11, 2022

Filed:

Dec. 31, 2019
Applicant:

Skiileux Electricity Inc., Taoyuan, TW;

Inventors:

Chien-Shou Liao, New Taipei, TW;

Te-Fu Chang, Taichung, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/12 (2006.01); H01L 23/34 (2006.01); H01L 21/00 (2006.01); H01L 21/44 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 25/075 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49816 (2013.01); H01L 23/345 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H01L 25/0655 (2013.01); H01L 25/0753 (2013.01); H01L 25/50 (2013.01); H01L 2224/812 (2013.01); H01L 2224/81007 (2013.01); H01L 2224/81224 (2013.01);
Abstract

A film structure, a chip carrier assembly, and a chip carrier device are provided. The film structure includes a film and a plurality of micro-heaters. In which, the film is applied on a substrate, and the plurality of micro-heaters is disposed on top of the film or in the film. The chip carrier assembly includes a circuit substrate and the film structure. In which, the circuit substrate carries a plurality of chips. The chip carrier device includes the chip carrier assembly and a suction unit. In which, the suction unit is arranged above the chip carrier assembly to attach on and transfer the plurality of chips to the circuit substrate. The chips are disposed on the circuit substrate through solder balls, and the micro-heaters heat the solder balls that are in contact with the chips.


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