The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2022
Filed:
Jan. 03, 2019
Applicant:
Lenovo (Beijing) Co., Ltd., Beijing, CN;
Inventors:
Assignee:
LENOVO (BEIJING) CO., LTD., Beijing, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); F28F 3/02 (2006.01); G06F 1/20 (2006.01); H01L 23/373 (2006.01); H01L 23/467 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3672 (2013.01); F28F 3/02 (2013.01); G06F 1/20 (2013.01); H01L 23/3736 (2013.01); F28F 2215/08 (2013.01); H01L 23/373 (2013.01); H01L 23/467 (2013.01);
Abstract
A heat dissipation structure is provided for an electronic device. The heat dissipation structure includes a substrate and cooling fins connected to the substrate. The substrate includes a thermally conductive material. A first surface of the substrate has a plurality of contact regions. The plurality of contact regions of the first surface contact at least one device to be cooled.