The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 11, 2022

Filed:

Feb. 27, 2019
Applicant:

Heliotrope Technologies, Inc., Alameda, CA (US);

Inventors:

Xiaoliang Wang, San Leandro, CA (US);

Evelyn Davies, Berkeley, CA (US);

Pedro Gonzalez, Oakland, CA (US);

Guillermo Garcia, Oakland, CA (US);

Amir Bayati, Santa Clara, CA (US);

John Bohland, Sacramento, CA (US);

Assignee:

HELIOTROPE TECHNOLOGIES, INC., Alameda, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02F 1/155 (2006.01); G02F 1/161 (2006.01); G02F 1/153 (2006.01); G02F 1/1523 (2019.01); G02F 1/15 (2019.01);
U.S. Cl.
CPC ...
G02F 1/155 (2013.01); G02F 1/15 (2013.01); G02F 1/1525 (2013.01); G02F 1/1533 (2013.01); G02F 1/161 (2013.01); G02F 2001/1555 (2013.01); G02F 2001/164 (2019.01); G02F 2202/025 (2013.01);
Abstract

A method of forming an electrochromic (EC) device includes forming a solid-state first electrolyte layer, after forming the solid-state first electrolyte layer, laminating the first solid-state first electrolyte layer between a transparent first substrate and a transparent second substrate such that a transparent first electrode is disposed between the first substrate and a first side of the solid-state first electrolyte layer, and a transparent second electrode is disposed between the second substrate and a second side of the solid-state first electrolyte layer, and applying a sealant to seal the solid-state first electrolyte layer between the first and second substrates and to form the EC device.


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