The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2022
Filed:
Feb. 08, 2018
Applicant:
Medtronic Minimed, Inc., Northridge, CA (US);
Inventors:
Akhil Srinivasan, Sherman Oaks, CA (US);
Yifei Wang, Sunnyvale, CA (US);
Assignee:
MEDTRONIC MINIMED, INC., Northridge, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/00 (2006.01); C23C 14/02 (2006.01); C23C 14/06 (2006.01); C23C 14/14 (2006.01); C23C 14/18 (2006.01); C23C 14/20 (2006.01); C23C 14/30 (2006.01); C23C 14/34 (2006.01); C23C 14/54 (2006.01); G01N 27/327 (2006.01); G01N 27/411 (2006.01); A61B 5/145 (2006.01);
U.S. Cl.
CPC ...
C23C 14/0005 (2013.01); A61B 5/14532 (2013.01); C23C 14/025 (2013.01); C23C 14/06 (2013.01); C23C 14/14 (2013.01); C23C 14/18 (2013.01); C23C 14/20 (2013.01); C23C 14/30 (2013.01); C23C 14/34 (2013.01); C23C 14/545 (2013.01); G01N 27/327 (2013.01); G01N 27/4115 (2013.01);
Abstract
A method of depositing of a film on a substrate with controlled adhesion. The method comprises depositing the film including metal, wherein the metal is deposited on the substrate using physical vapor deposition at a pressure that achieves a pre-determined adhesion of the film to the substrate. The pre-determined adhesion allows processing of the film into a device while the film is adhered to the substrate but also allows removal of the device from the substrate.