The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 11, 2022

Filed:

Apr. 05, 2017
Applicant:

Mitsubishi Heavy Industries, Ltd., Tokyo, JP;

Inventors:

Kazuma Takeno, Tokyo, JP;

Mitsutoshi Maeda, Tokyo, JP;

Hiroshi Tokutomi, Tokyo, JP;

Tetsuya Sato, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 70/54 (2006.01); B29C 70/44 (2006.01); B29L 31/30 (2006.01);
U.S. Cl.
CPC ...
B29C 70/548 (2013.01); B29C 70/443 (2013.01); B29K 2913/00 (2013.01); B29K 2995/0073 (2013.01); B29L 2031/3076 (2013.01);
Abstract

A method for manufacturing a composite material includes placing a netlike sheet material, through which a resin composition permeates, on reinforcing fiber substrates disposed on a forming die. The method includes covering the reinforcing fiber substrates disposed on the forming die and the bag surface-smoothing sheet with a bag film to form a sealed forming space between the bag film and the forming die. The method includes infusing a resin composition into the forming space to impregnate the reinforcing fiber substrates. The method includes curing the resin composition impregnated in the reinforcing fiber substrates. Warp yarns and weft yarns are disposed in a lattice pattern and, after placing the bag surface-smoothing sheet on the reinforcing fiber substrates so that the warp yarns and the weft yarns form acute angles with respect to corners of the reinforcing fiber substrates, the bag surface-smoothing sheet projecting from the reinforcing fiber substrates is bent.


Find Patent Forward Citations

Loading…