The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 11, 2022

Filed:

Jun. 28, 2017
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Shinya Watanabe, Hyogo, JP;

Satoshi Abe, Osaka, JP;

Kenichi Tanaka, Osaka, JP;

Mikio Mori, Osaka, JP;

Yoshiyuki Uchinono, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 45/27 (2006.01); B22F 10/20 (2021.01); B33Y 80/00 (2015.01); B29C 33/38 (2006.01); B33Y 10/00 (2015.01);
U.S. Cl.
CPC ...
B29C 45/2737 (2013.01); B22F 10/20 (2021.01); B29C 33/3842 (2013.01); B29C 45/27 (2013.01); B33Y 80/00 (2014.12); B29K 2905/00 (2013.01); B33Y 10/00 (2014.12);
Abstract

To manufacture a sprue-bush which is capable of suitably cooling a melt raw resin in a raw resin-flow path as a whole, there is provided a method for manufacturing a sprue-bush, wherein a shaped part is located on a base part to manufacture the sprue-bush, the base part comprising a raw resin-flow path and a cooling medium-flow path, wherein, in the shaped part, a downstream raw resin-flow path portion is located and a downstream cooling medium-flow path portion is also located, the downstream raw resin-flow path portion corresponding to a downstream side region of a raw resin-flow path of the sprue-bush, the downstream cooling medium-flow path portion being positioned around the downstream raw resin-flow path portion and corresponding to a downstream side region of a cooling medium-flow path of the sprue-bush, and wherein the downstream cooling medium-flow path portion is located to surround the downstream raw resin-flow path portion.


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