The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 11, 2022

Filed:

Oct. 27, 2017
Applicant:

Hrl Laboratories, Llc, Malibu, CA (US);

Inventors:

Shanying Cui, Calabasas, CA (US);

Adam F. Gross, Santa Monica, CA (US);

Florian G. Herrault, Agoura Hills, CA (US);

Assignee:

HRL Laboratories, LLC, Malibu, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 1/00 (2006.01); H01F 1/11 (2006.01);
U.S. Cl.
CPC ...
B05D 1/007 (2013.01); H01F 1/11 (2013.01);
Abstract

In some variations, the invention provides a method of depositing nanoparticles on a substrate, comprising: providing a substrate having a positive or negative surface charge; optionally depositing a polymer on the substrate, wherein the polymer has opposite charge polarity compared to the substrate; and simultaneously depositing first nanoparticles and second nanoparticles onto the substrate, wherein the first nanoparticles and the second nanoparticles have opposite charge polarities during depositing. Other variations provide a method of depositing a layer of nanoparticles on a substrate, the method comprising: providing a substrate having a positive or negative surface charge; providing faceted nanoparticles; preparing a nanoparticle solution containing the nanoparticles; and adjusting surface charge of the nanoparticles by changing the solution pH to reduce the magnitude of average zeta potential of the nanoparticles, thereby causing aggregation of the nanoparticles onto the substrate surface. Very high packing densities may be achieved with these methods.


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