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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11219879 B1

PDFFull Text
Date of Patent:
Jan. 11, 2022

Filed:

Sep. 28, 2015

Aluminophosphate-metal oxide bonded body and production method for same

Applicant:

Ngk Insulators, Ltd., Nagoya, JP;

Inventors:

Takeshi Hagio, Nagoya, JP;

Makoto Miyahara, Nagoya, JP;

Tetsuya Uchikawa, Nagoya, JP;

Makiko Ichikawa, Nagoya, JP;

Kenichi Noda, Nagoya, JP;

Kenji Yajima, Nagoya, JP;

Assignee:

NGK Insulators, Ltd., Nagoya, JP;

Attorney:

Burr & Brown, PLLC

Primary Examiner:

Humera N Sheikh

Assistant Examiner:

Elizabeth D Ivey

Int. Cl.
CPC ...
B01J 20/06 (2006.01); B01D 69/12 (2006.01); B01D 71/02 (2006.01); B01D 67/00 (2006.01); B01J 20/30 (2006.01); C01B 37/04 (2006.01); C04B 35/63 (2006.01); B01D 63/06 (2006.01); C04B 38/00 (2006.01); C04B 35/447 (2006.01); B01J 20/28 (2006.01); C01B 39/54 (2006.01); C04B 111/00 (2006.01);
U.S. Cl.
CPC ...
B01J 20/06 (2013.01); B01D 63/066 (2013.01); B01D 67/0051 (2013.01); B01D 69/12 (2013.01); B01D 71/022 (2013.01); B01D 71/028 (2013.01); B01J 20/28042 (2013.01); B01J 20/3078 (2013.01); C04B 35/447 (2013.01); C04B 35/6309 (2013.01); C04B 35/6313 (2013.01); C04B 38/0035 (2013.01); B01D 2323/12 (2013.01); C01B 37/04 (2013.01); C01B 39/54 (2013.01); C04B 2111/00801 (2013.01); C04B 2235/3206 (2013.01); C04B 2235/3208 (2013.01); C04B 2235/3217 (2013.01); C04B 2235/3232 (2013.01); C04B 2235/3418 (2013.01); C04B 2235/447 (2013.01); C04B 2235/781 (2013.01); Y02P 20/129 (2015.11);
Abstract

An aluminophosphate-metal oxide bonded body including a metal oxide having a bonding surface on a part of the surface thereof, and aluminophosphate that is disposed on the bonding surface of the metal oxide, wherein an alkali metal, an alkaline earth metal or both of these is/are disposed on the bonding surface of the metal oxide, and the content rate of the alkali metal, alkaline earth metal or both is from 0.3 to 30.0% by mass with respect to all of the substances that are disposed on the bonding surface of the metal oxide. An aluminophosphate-metal oxide bonded body that provides a favorable bonded state even for complicated shapes is provided.

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