The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 04, 2022

Filed:

Mar. 29, 2019
Applicant:

Facebook Technologies, Llc, Menlo Park, CA (US);

Inventor:

Pooya Saketi, Cork, IE;

Assignee:

Facebook Technologies, LLC, Menlo Park, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 13/08 (2006.01); H05K 13/04 (2006.01); H01L 21/67 (2006.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H05K 13/082 (2018.08); H01L 21/67144 (2013.01); H01L 33/005 (2013.01); H05K 13/0408 (2013.01); H05K 13/0478 (2013.01); H05K 13/0882 (2018.08); Y10T 29/4913 (2015.01); Y10T 29/53178 (2015.01);
Abstract

To manufacture a device by picking and placing semiconductor devices from a carrier substrate to a target substrate using touch down sensors, a pick-up head including touch down sensors and the semiconductor devices on the carrier substrate are moved relative to each other to contact the carrier substrate with the touch down sensors. Signals from each touch down sensor indicating a degree of deformation of each touch down sensor caused by the contact with the carrier substrate are used to determine an orientation of the pick-up head by processing the signals, and adjust the orientation of the pick-up head based on the determined orientation to attach the semiconductor devices onto the pick-up head. In some embodiments, the touch down sensors are piezoelectric benders.


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