The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 04, 2022

Filed:

Mar. 13, 2020
Applicant:

Nec Platforms, Ltd., Kawasaki, JP;

Inventor:

Takahiro Yagi, Kanagawa, JP;

Assignee:

NEC Platforms, Ltd., Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 5/02 (2006.01);
U.S. Cl.
CPC ...
H05K 7/2039 (2013.01); H05K 5/0213 (2013.01);
Abstract

A heat dissipation structure capable of improving heat dissipation efficiency and regulating temperature distribution of a surface of a housing is provided. A heat dissipation structureis provided in a housingthat accommodates a heat generating sourcetherein, the heat dissipation structureincluding: top surface partsandopposed to each other, in which the top surface partincludes a plurality of concave-shaped partsB-F that are aligned, the top surface partincludes a plurality of concave-shaped partsB-F that are aligned, the concave-shaped partsB-F of the top surface partare opposed to the concave-shaped partsB-F of the top surface part, outletsA are formed in the concave-shaped partsD,E, andF, and outletsA are formed in the concave-shaped partsC,D,E, andF.


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Yagi, Takahiro. (2022). Heat dissipation structure (U.S. Patent No. 11219138). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11219138

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