The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 04, 2022
Filed:
Feb. 10, 2021
Nippon Mektron, Ltd., Tokyo, JP;
Fumihiko Matsuda, Tokyo, JP;
Yoshihiko Narisawa, Tokyo, JP;
Kenji Kumagai, Tokyo, JP;
Daisuke Shiokawa, Tokyo, JP;
Yuki Ogi, Tokyo, JP;
Akihiko Toyoshima, Tokyo, JP;
Masami Uchino, Tokyo, JP;
Isao Arase, Tokyo, JP;
Hiroshi Takeuchi, Tokyo, JP;
NIPPON MEKTRON, LTD., Tokyo, JP;
Abstract
Provided is a printed circuit board which includes: a first dielectric layer including a first principal surface and a second principal surface on a side opposite to the first principal surface; a first adhesive layer formed on the first principal surface; a first metal foil pattern formed on the first adhesive layer and forming a signal line; and a second metal foil pattern formed on the second principal surface and forming a ground layer, in which the first metal foil pattern has a higher specific conductivity than a specific conductivity of the second metal foil pattern.