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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11218688 B1

PDFFull Text
Date of Patent:
Jan. 04, 2022

Filed:

Jan. 04, 2017

Apparatus and methods for three-dimensional sensing

Applicant:

Occipital, Inc., Boulder, CO (US);

Inventors:

Jeffrey Roger Powers, San Francisco, CA (US);

Vikas Muppidi Reddy, Boulder, CO (US);

Paul Jakob Schroeder, Boulder, CO (US);

Christopher Caleb Slaughter, Boulder, CO (US);

Roger Wayne Landowski, Boulder, CO (US);

Davis Thorp Foster, Boulder, CO (US);

Evan Haley Fletcher, Boulder, CO (US);

Assignee:

Occipital, Inc., Boulder, CO (US);

Attorney:

Lee & Hayes, P.C.

Primary Examiner:

John R Lee

Int. Cl.
CPC ...
H01S 5/42 (2006.01); G01J 1/42 (2006.01); G02B 27/10 (2006.01); G02B 27/30 (2006.01); H01S 5/00 (2006.01); H01S 5/022 (2021.01); H01S 5/024 (2006.01); H04N 13/20 (2018.01); H04N 13/254 (2018.01); G06T 7/521 (2017.01); H04N 5/33 (2006.01); H04N 13/271 (2018.01); H04N 13/296 (2018.01); H04N 13/239 (2018.01); H04N 5/225 (2006.01); H04N 5/361 (2011.01); H04N 5/357 (2011.01); H04N 17/00 (2006.01); H04N 5/232 (2006.01); G02B 27/42 (2006.01); G06T 7/593 (2017.01); H01S 5/02325 (2021.01); H01S 5/02345 (2021.01); H01S 5/02355 (2021.01); H04N 13/00 (2018.01); G01J 1/44 (2006.01);
U.S. Cl.
CPC ...
H04N 13/254 (2018.05); G01J 1/4204 (2013.01); G01J 1/4257 (2013.01); G02B 27/106 (2013.01); G02B 27/1086 (2013.01); G02B 27/30 (2013.01); G02B 27/4205 (2013.01); G06T 7/521 (2017.01); G06T 7/593 (2017.01); H01S 5/0014 (2013.01); H01S 5/024 (2013.01); H01S 5/02325 (2021.01); H01S 5/02345 (2021.01); H01S 5/02355 (2021.01); H01S 5/423 (2013.01); H04N 5/2256 (2013.01); H04N 5/23241 (2013.01); H04N 5/332 (2013.01); H04N 5/3572 (2013.01); H04N 5/361 (2013.01); H04N 13/239 (2018.05); H04N 13/271 (2018.05); H04N 13/296 (2018.05); H04N 17/002 (2013.01); G01J 2001/446 (2013.01); G06T 2207/10012 (2013.01); G06T 2207/10048 (2013.01); H04N 2013/0081 (2013.01);
Abstract

A three-dimensional (3D) sensing apparatus together with a projector subassembly is provided. The 3D sensing apparatus includes two cameras, which may be configured to capture ultraviolet and/or near-infrared light. The 3D sensing apparatus may also contain an optical filter and one or more computing processors that signal a simultaneous capture using the two cameras and processing the captured images into depth. The projector subassembly of the 3D sensing apparatus includes a laser diode, one or optical elements, and a photodiode that are useable to enable 3D capture.

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