The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 04, 2022

Filed:

Jul. 10, 2020
Applicant:

Southern University of Science and Technology, Shenzhen, CN;

Inventors:

Guobiao Zhang, Corvallis, OR (US);

Hongyu Yu, Shenzhen, CN;

Yuejin Guo, Shenzhen, CN;

Shengming Zhou, Shenzhen, CN;

Guoxing Zhang, Shenzhen, CN;

Guangzhao Liu, Shenzhen, CN;

Mingtao Hu, Shenzhen, CN;

Wang Zhang, Shenzhen, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/64 (2006.01); H01L 21/48 (2006.01); H01L 21/683 (2006.01); H01L 23/538 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/642 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/6835 (2013.01); H01L 23/5383 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 28/92 (2013.01); H01L 2221/68372 (2013.01);
Abstract

A three-dimensional (3-D) module with integrated passive components includes a plurality of vertically stacked sub-modules. Each sub-module comprises a device level comprising a high-k dielectric (e.g. ceramic) material and an interconnect level comprising a low-k dielectric (e.g. organic) material. The passive components in the device level are fired integrally, whereas the device level and the interconnect level are fired independently.


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