The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 04, 2022
Filed:
Aug. 23, 2018
Applicant:
Sumitomo Electric Industries, Ltd., Osaka, JP;
Inventors:
Kenichi Sawada, Osaka, JP;
Jiro Shinkai, Osaka, JP;
Assignee:
SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/373 (2006.01); H01L 23/043 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 29/16 (2006.01); H01L 25/07 (2006.01); H01L 25/00 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49562 (2013.01); H01L 23/043 (2013.01); H01L 23/373 (2013.01); H01L 29/1608 (2013.01);
Abstract
A semiconductor module includes a semiconductor chip having a first surface provided with a first electrode pad and a second surface, opposite to the first surface, provided with a second electrode pad, a first substrate connected to the first electrode pad, a second substrate provided on the side of the second surface, and a conductor section, electrically connecting the second electrode pad and the second substrate, and having a size greater than the second electrode pad in a plan view viewed from the side of the second substrate.