The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 04, 2022

Filed:

Sep. 17, 2020
Applicant:

Littelfuse, Inc., Chicago, IL (US);

Inventors:

Irma Valeriano Santos, Chicago, IL (US);

G. Todd Dietsch, Park Ridge, IL (US);

Assignee:

Littelfuse, Inc., Chicago, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01H 85/17 (2006.01); H01H 85/041 (2006.01); H01H 85/06 (2006.01); H01H 85/165 (2006.01);
U.S. Cl.
CPC ...
H01H 85/17 (2013.01); H01H 85/0411 (2013.01); H01H 85/06 (2013.01); H01H 85/165 (2013.01); H01H 2085/0412 (2013.01); H01H 2085/0414 (2013.01);
Abstract

A high breaking capacity chip fuse including a bottom insulative layer, a first intermediate insulative layer, a second intermediate insulative layer, and a top insulative layer disposed in a stacked arrangement in the aforementioned order, a fusible element disposed between the first and second intermediate insulative layers and extending between electrically conductive first and second terminals at opposing longitudinal ends of the bottom insulative layer, the first intermediate insulative layer, the second intermediate insulative layer, and the top insulative layer, wherein the first and second intermediate insulative layers are formed of porous ceramic.


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