The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 04, 2022

Filed:

Mar. 16, 2020
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Yuichi Nagai, Tokyo, JP;

Atsushi Takeda, Tokyo, JP;

Takehisa Tamura, Tokyo, JP;

Shinya Onodera, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01G 4/005 (2006.01); H01G 4/30 (2006.01); H01G 4/12 (2006.01); H05K 3/34 (2006.01); H01G 4/232 (2006.01);
U.S. Cl.
CPC ...
H01G 4/005 (2013.01); H01G 4/30 (2013.01); H01G 4/12 (2013.01); H01G 4/232 (2013.01); H05K 3/34 (2013.01);
Abstract

An electronic component includes an element body and an external electrode disposed on the element body. The element body includes a principal surface arranged to constitute a mounting surface and an end surface adjacent to the principal surface. The external electrode includes a conductive resin layer disposed to continuously cover a part of the principal surface and a part of the end surface, and a plating layer covering the conductive resin layer. The conductive resin layer includes a first region positioned on the end surface and a second region positioned on the principal surface. A maximum thickness of the second region is larger than a maximum thickness of the first region.


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