The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 04, 2022

Filed:

Sep. 29, 2020
Applicant:

Shanghai Zhaoxin Semiconductor Co., Ltd., Shanghai, CN;

Inventors:

Jinglong Liu, Beijing, CN;

Qunchao Feng, Beijing, CN;

Yankui Niu, Beijing, CN;

Yongfeng Song, Beijing, CN;

Jintao Wang, Beijing, CN;

Jiangbo Wang, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 9/445 (2018.01); G06F 9/4401 (2018.01); G06F 13/42 (2006.01);
U.S. Cl.
CPC ...
G06F 9/44505 (2013.01); G06F 9/4405 (2013.01); G06F 9/4406 (2013.01); G06F 13/4282 (2013.01); G06F 2213/0002 (2013.01);
Abstract

A multi-die and multi-core computing platform in which multiple dies share the same storage device for firmware code storage is shown. After a slave die loads #1 firmware code from the storage device through a bus, the right to use the bus is released by the slave die and the slave die outputs a #0 enable signal to a master die. According to the #0 enable signal, the master die gains the right to use the bus. Through the bus, the master die loads #0 firmware code from the storage device. The slave die executes the #1 firmware code and the master die executes the #0 firmware code to initialize a link between the master and slave dies.


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