The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 04, 2022
Filed:
Jul. 09, 2020
Samsung Display Co., Ltd., Yongin-si, KR;
Chong-Guk Lee, Seoul, KR;
Joo-Yeon Won, Seoul, KR;
Se-Hul Jang, Yongin-si, KR;
Su-Mi Moon, Yongin-si, KR;
Dong-Wook Lee, Cheonan-si, KR;
SAMSUNG DISPLAY CO., LTD., Yongin, KR;
Abstract
A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.