The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 04, 2022

Filed:

Sep. 30, 2018
Applicant:

Nanjing Estun Automation Co., Ltd, Nanjing, CN;

Inventors:

Tian Yao, Nanjing, CN;

Guojun Yu, Nanjing, CN;

Maoyu Miao, Nanjing, CN;

Xiaojun Xu, Nanjing, CN;

Wei Qian, Nanjing, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/26 (2020.01); G01K 7/42 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2601 (2013.01); G01K 7/427 (2013.01);
Abstract

The present invention discloses a real-time online prediction method for a dynamic junction temperature of a semiconductor power device. The present invention has advantages as follows: the sampling value of electrical parameters required for system closed-loop control is multiplexed as inputs, and no additional system hardware circuits and costs are needed; the processor resources can be saved to the utmost extent by using the idea of discrete iterative calculation, online calculation can be realized, and real-time performance of dynamic junction temperature calculation can be ensured; an optimal fitting dynamic thermal resistance discretization model is creatively proposed, and is used to perform iterative calculation, so that while real-time performance of dynamic junction temperature calculation of the power device is ensured, calculation accuracy is also ensured, meeting the requirements of protection, life prediction, and reliability design of the power device, and this method is very suitable for actual engineering application.


Find Patent Forward Citations

Yao, Tian. (2022). Real-time online prediction method for dynamic junction temperature of semiconductor power device (U.S. Patent No. 11215657). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11215657

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