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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11215514 B1

PDFFull Text
Date of Patent:
Jan. 04, 2022

Filed:

Sep. 29, 2017

Electronic component for welding, mounted board and temperature sensor

Applicant:

Semitec Corporation, Tokyo, JP;

Inventors:

Takaaki Hirabayashi, Tokyo, JP;

Dezhi Cheng, Tokyo, JP;

Assignee:

SEMITEC Corporation, Tokyo, JP;

Attorney:

JCIPRNET

Primary Examiner:

Kyung S Lee

Int. Cl.
CPC ...
G01K 7/22 (2006.01); G01K 7/18 (2006.01); H01C 1/14 (2006.01); H01C 17/28 (2006.01); H01G 4/228 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
G01K 7/223 (2013.01); G01K 7/183 (2013.01); H01C 1/1406 (2013.01); H01C 1/1413 (2013.01); H01C 17/28 (2013.01); H01G 4/228 (2013.01); H05K 1/18 (2013.01);
Abstract

The present invention enables the achievement of: high density mounting by means of an electronic component for welding; and improvement of thermal responsivity and tensile strength at high temperatures by means of reduction in size and thickness of a temperature sensor. An electronic component for welding, which has a function of a resistor, a capacitor, an inductor or the like, comprises: an insulating substrate; a function part and a bonding electrode part, which are provided on the insulating substrate; and a lead which is electrically connected to the bonding electrode part. The bonding electrode part is configured of: an adhesive active metal layer which is formed from a high-melting-point metal on the insulating substrate; a barrier layer which is formed from a high-melting-point metal on the active metal layer; and a bonding metal layer which is mainly composed of a low-melting-point metal and is formed on the barrier layer.

Find Patent Forward Citations

Hirabayashi, Takaaki. (2022). Electronic component for welding, mounted board and temperature sensor (U.S. Patent No. 11215514). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11215514

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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