The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 04, 2022

Filed:

Dec. 12, 2019
Applicant:

Avermedia Technologies, Inc., New Taipei, TW;

Inventors:

Jui-Hung Kao, New Taipei, TW;

Yu-Chin Liu, New Taipei, TW;

Wen-Tse Yan, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28F 13/18 (2006.01); F28F 13/08 (2006.01); F28F 21/08 (2006.01);
U.S. Cl.
CPC ...
F28F 13/18 (2013.01); F28F 13/08 (2013.01); F28F 21/081 (2013.01); F28F 2215/08 (2013.01);
Abstract

A heat dissipation device includes a heat conducting plate and a heat sink. The heat conducting plate has a first surface and a second surface opposite to each other. The heat sink is coupled to the first surface of the heat conducting plate. The heat sink includes a first peak portion, a second peak portion, a valley portion and a first curved surface. The first peak portion and the second peak portion are adjacent to each other. The valley portion is located between the first peak portion and the second peak portion. The first curved surface is coupled between the first peak portion and the valley portion. An extension line perpendicular to a corresponding tangent line of the first curved surface passes between the first peak portion and the second peak portion.


Find Patent Forward Citations

Loading…