The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 04, 2022

Filed:

Nov. 19, 2019
Applicant:

Xaar Technology Limited, Cambridge, GB;

Inventors:

Anirban Lahiri, St. Ives, GB;

Mujahid-ul Islam, Griton, GB;

Mario Massucci, Cambridge, GB;

Ian Anthony Hurst, Wilburton, GB;

Stephen Mark Jeapes, Cambridge, GB;

Neil Christopher Bird, Cambridge, GB;

Anthony Saugey, Nogent sur Marne, FR;

Assignee:

Xaar Technology Limited, Cambridge, GB;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/045 (2006.01);
U.S. Cl.
CPC ...
B41J 2/04541 (2013.01); B41J 2/0459 (2013.01); B41J 2/04515 (2013.01); B41J 2/04573 (2013.01); B41J 2/04581 (2013.01); B41J 2/04586 (2013.01); B41J 2/04588 (2013.01);
Abstract

A drive circuit () for driving actuators of a printhead () from a common drive waveform has a switching circuit () for coupling the common drive waveform to an actuator (), and a timing circuit () to control the switching circuit to form a drive pulse from the common drive waveform. The drive pulse is trimmed by controlling a duration (TTRIM) of a step at an intermediate level (VHOLD) in the drive pulse. This can improve the trade-off between available range of trimming and thermal efficiency because the voltage drop across the switching circuit can be reduced, compared to trimming only the height. Decoupling during a flat portion of the common drive waveform can enable the timing of the decoupling to be more relaxed compared to decoupling during a slope. Such relaxing can enable costs, complexity and thermal loading to be reduced.


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