The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 04, 2022

Filed:

Dec. 13, 2017
Applicant:

Hexcel Reinforcements Sasu, Dagneux, FR;

Inventors:

Mayeul Ducrot, Viviers du Lac, FR;

Sylvain Delalande, Le Bourget du Lac, FR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 43/00 (2006.01); B29C 43/02 (2006.01); B32B 27/12 (2006.01); C08J 5/24 (2006.01); B32B 27/08 (2006.01); B32B 7/022 (2019.01); B32B 5/26 (2006.01); B29C 70/08 (2006.01); B29K 105/12 (2006.01); B29K 105/00 (2006.01);
U.S. Cl.
CPC ...
B29C 43/003 (2013.01); B29C 43/021 (2013.01); B32B 5/26 (2013.01); B32B 7/022 (2019.01); B32B 27/08 (2013.01); B32B 27/12 (2013.01); C08J 5/241 (2021.05); B29C 70/08 (2013.01); B29C 2043/026 (2013.01); B29K 2105/12 (2013.01); B29K 2105/256 (2013.01); B32B 2260/023 (2013.01); B32B 2262/10 (2013.01); B32B 2307/738 (2013.01); Y10T 428/24994 (2015.04); Y10T 428/24995 (2015.04);
Abstract

The invention relates to a blank for compression moulding a part in a compression mould comprising one or more moulding recesses, said blank comprising a body formed from a first moulding compound comprising a fibrous reinforcement material and a thermo-curable resin material, and a region located on the surface of the body formed from a second moulding compound; said second moulding compound comprising a fibrous reinforcement material and a thermo-curable resin material, and exhibiting increased flow at one or more temperatures between 20° C. and the cured Tg of the first moulding compound compared to the flow of the first moulding compound at the same temperature.


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