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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11212947 B1

PDFFull Text
Date of Patent:
Dec. 28, 2021

Filed:

Apr. 05, 2017

Power module with capacitor configured for improved thermal management

Applicant:

Epcos Ag, Munich, DE;

Inventors:

Markus Koini, Seiersberg, AT;

Jürgen Konrad, Graz, AT;

Georg Kügerl, Eibiswald, AT;

Assignee:

EPCOS AG, Munich, DE;

Attorney:

Nixon Peabody LLP

Primary Examiner:

Ajay Arora

Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01G 4/30 (2006.01); H01G 4/38 (2006.01); H01G 4/40 (2006.01); H01G 4/12 (2006.01); C04B 35/493 (2006.01); H01G 4/008 (2006.01); C04B 37/00 (2006.01); C04B 37/02 (2006.01); H01G 4/228 (2006.01); H01L 23/373 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2006.01); H01L 49/02 (2006.01); H01G 2/08 (2006.01);
U.S. Cl.
CPC ...
H05K 7/2089 (2013.01); C04B 35/493 (2013.01); C04B 37/006 (2013.01); C04B 37/023 (2013.01); H01G 4/008 (2013.01); H01G 4/0085 (2013.01); H01G 4/1218 (2013.01); H01G 4/1245 (2013.01); H01G 4/228 (2013.01); H01G 4/30 (2013.01); H01G 4/38 (2013.01); H01G 4/40 (2013.01); H01L 23/3735 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 25/16 (2013.01); H01L 28/55 (2013.01); H01L 28/87 (2013.01); C04B 2235/3224 (2013.01); C04B 2235/3225 (2013.01); C04B 2235/3227 (2013.01); C04B 2235/3229 (2013.01); C04B 2235/3249 (2013.01); C04B 2235/3279 (2013.01); C04B 2235/3281 (2013.01); C04B 2235/3296 (2013.01); C04B 2235/3298 (2013.01); C04B 2235/3418 (2013.01); C04B 2235/768 (2013.01); C04B 2235/79 (2013.01); C04B 2237/125 (2013.01); C04B 2237/346 (2013.01); C04B 2237/348 (2013.01); C04B 2237/40 (2013.01); C04B 2237/72 (2013.01); H01G 2/08 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/32265 (2013.01); H01L 2224/8384 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19104 (2013.01);
Abstract

A module having a power semiconductor device and a ceramic capacitor which is configured for cooling the power semiconductor device.

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